Manufacturing method of hall board for vacuum suction and packaging method of the organic electrolum

专利摘要:
The present invention relates to a method of manufacturing a vacuum suction hole substrate and a method of packaging an organic electroluminescent device using the hole substrate, and more particularly, to forming a metal thin film on a glass substrate and a photoresist. A hole substrate through which a plurality of holes are vertically passed through a pattern forming step, a metal structure forming step, a photoresist pattern peeling step, a metal thin film removing step, and a hole forming step; Using this hole substrate, a plurality of sealing caps are vacuum adsorbed and placed on the light emitting substrate to be bonded to each other, followed by releasing the vacuum to cut the sealing cap and the light emitting substrate to an appropriate size to produce a large number of organic ELs. The present invention relates to a method for manufacturing a vacuum suction hole substrate and a method for packaging an organic EL device using the hole substrate.
公开号:KR20040061697A
申请号:KR1020020087984
申请日:2002-12-31
公开日:2004-07-07
发明作者:조수제
申请人:주식회사 멤스웨어；
IPC主号:

专利说明:

Manufacturing method of hall board for vacuum suction and packaging method of the organic electroluminescent using the hall board}
[15] The present invention relates to a method for manufacturing a vacuum suction hole substrate and a method for packaging an organic electroluminescent device (hereinafter referred to as an organic EL device) using the hole substrate. More specifically, the glass substrate A hole substrate having a plurality of holes vertically passed through a metal thin film forming step, a photoresist pattern forming step, a metal structure forming step, a photoresist pattern peeling step, a metal thin film removing step, and a hole forming step; ; Using this hole substrate, a plurality of sealing caps are vacuum adsorbed and placed on the light emitting substrate to be bonded to each other, followed by releasing the vacuum to cut the sealing cap and the light emitting substrate to an appropriate size to produce a large number of organic ELs. The present invention relates to a method for manufacturing a vacuum suction hole substrate and a method for packaging an organic EL device using the hole substrate.
[16] As is well known, a flat panel display (FPD) is classified into an organic using device and an inorganic using device according to the type of material used, and the inorganic using device is a plasma display panel (PDP) and an electric field emission. Field emission displays (FEDs) and the like, and organic materials using liquid crystal displays (LCDs) and organic electroluminescent displays (OELDs) are known.
[17] In particular, the organic EL device has a response speed of more than 30,000 times faster than the commercially available LCD, which enables video to be realized, and because it is a self-luminous device, it has a wide range of viewing angles and shows high brightness. I'm getting it.
[18] A general manufacturing process of such an organic EL device will be briefly described with reference to FIGS. 1A to 1E.
[19] FIG. 1A illustrates the steps of forming an ITO film and forming a pattern, and forms a transparent electrode (ITO) 2 used as an anode electrode on an upper surface of the light emitting substrate 1.
[20] FIG. 1B is a step of forming a cathode separation partition wall, and since the organic EL element is difficult to form a pattern by a photo process, an isolation partition 3 for pattern formation of a cathode electrode is formed on the substrate 1.
[21] FIG. 1C illustrates an organic film deposition process step, in which an organic film 4 is deposited on the anode electrode 2 and the cathode separation barrier 3.
[22] FIG. 1D illustrates a cathode electrode forming process step, in which a cathode electrode 5 is formed on an upper surface of the organic film 4.
[23] FIG. 1E illustrates an encapsulation process step in which the encapsulant 7 is encapsulated in a state in which nitrogen gas is enclosed in order to protect the organic EL device from external moisture and oxygen. By sealing the back of the device.
[24] An example in which the encapsulant 6 of the organic EL device manufactured by the above-described process is made of a stainless steel capsule (hereinafter referred to as SUS CAN) will be briefly described with reference to FIG. 2 as follows.
[25] Since the transparent substrate 10 should be able to see through the light emitted from the organic layer 30 by the voltage applied between the anode 20 and the cathode 40, a glass substrate is usually used.
[26] The anode electrode 20 functions to supply holes, and a transparent electrode such as an indium tin oxide film (ITO) capable of transmitting light emitted from the organic layer 30 is used.
[27] The organic layer 30 includes an emission layer (EML) at the center, and a hole transport layer (HTL) and a hole injection layer (HIL) are formed below the emission layer, and an electron transport layer (ETL) and an electron layer are formed above the emission layer. .
[28] The cathode electrode 40 supplies electrons, and a metal having a low work function is used to supply electrons smoothly.
[29] The moisture absorbent 50 is attached to the inner surface of the SUS CAN 60 which is an outer capping part of the organic EL element to remove moisture penetrated from the outside.
[30] The SUS CAN 60 is to block external moisture, and the moisture absorbent 50 is mounted and adhered to the transparent substrate 10, which is a light emitting substrate, by the sealing material 70. The sealing material 70 is used to assemble the transparent substrate 10 and the SUS CAN 60, and is for blocking the penetration of external moisture.
[31] In the organic EL device manufactured as described above, when a positive voltage is applied to the positive electrode 20 and a negative voltage is applied to the negative electrode 40, holes are emitted from the positive electrode 20, and the negative electrode 40 is discharged to the negative electrode 40. From the electrons are emitted to emit light by recombination of electrons and holes in the organic layer (30).
[32] In the manufacturing process of the organic EL device, the encapsulation process is an important process for preventing the occurrence of dark spots by protecting the organic EL device from external moisture and oxygen.
[33] First, the SUS CAN 60, which is an encapsulant for protecting the organic EL device from external moisture or oxygen, is cleaned by oxygen (O ₂ ) or argon (Ar) plasma treatment (S1), and the cleaned SUS CAN (60). The moisture absorbent 50 is attached to the inner surface of the (S2), and then the sealing material 70 is formed on the edge of the substrate 10 (S3).
[34] Next, after assembling the SUS CAN 60 to the sealing material 70 of the substrate 10 (S4), the SUS CAN 60 is cured by irradiating heat or ultraviolet rays to cure the sealing material 70 so that the SUS CAN 60 is exposed to the substrate 10. On the back side of the organic EL element to be sealed in a state of blocking the outside (S5).
[35] The encapsulation process according to the prior art carried out as described above has various problems as follows.
[36] First, SUS CAN (60) is that the adhesive properties, unlike the nature of the glass adhesive seal material for the material is reduced in the external moisture used in the back surface of the organic EL device of the mounting and penetration prevention and device of the moisture in the absorbent protective film (H ₂ As O) penetrates into the device, the device deteriorates and the life of the panel is shortened.
[37] In order to solve this problem, conventionally, this problem is solved by performing plasma treatment on the SUS CAN 60 before assembling the transparent substrate 10 and the SUS CAN 60.
[38] However, there is a problem that the manufacturing cost is significantly increased when introducing a vacuum process such as plasma treatment.
[39] In addition, when the plasma treatment is incompletely performed, a gap is generated between the SUS CAN 60 and the sealing material 70 and moisture is penetrated from the outside, thereby shortening the life of the panel.
[40] In addition, since the SUS CAN 60 may not have precision in the manufacturing process, since the thickness of the SUS CAN 60 occupies approximately 1.5 to 2 mm, there is a problem that it is difficult to realize the thinning of the product.
[41] In summary, the general manufacturing process of the organic EL device is largely composed of ITO electrode film formation and pattern formation process, cathode separation partition wall formation process, organic film deposition process using a deposition mask and forming the upper electrode on the organic film. have.
[42] However, since the organic film that generates light is vulnerable to external moisture, a process of encapsulating only the light emitting part is taken thereafter.
[43] In general, the encapsulant is made of stepped stainless steel or glass, and in particular, glass has an effect of transmitting ultraviolet rays, which not only has a considerable advantage when bonding with commonly used UV-curable resins, but also from stainless steel. It also has the effect of reducing the influence of the reflected light reflected.
[44] Currently, in the case of encapsulation on a large area light emitting substrate, a method of forming a plurality of glass caps on glass of a light emitting substrate size and cutting them out is widely used.
[45] In this case, as the thickness of the glass cap is reduced, there is a high risk of breakage when handling a large area light emitting substrate on which a plurality of glass caps are formed, and thus, it is difficult to reduce the thickness of the glass cap. In order to provide a method for forming a plurality of organic EL sealing cap on a large area display light emitting substrate.
[46] SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and in the construction of a sealing cap for sealing the light emitting element on a large area light emitting substrate on which a plurality of organic EL displays are formed, After vacuum-adsoring a plurality of sealing caps to settle and bond them on the light emitting substrate at one time, the vacuum is released to maintain the state in which the sealing cap is bonded on the light emitting substrate continuously and at the same time, the plurality of sealing caps By cutting the bonded light emitting substrate by the number of sealing caps, the productivity of the organic EL package can be increased, and a thinner sealing cap can be employed, thereby reducing the weight of the display. It is an object of the present invention to provide a manufacturing method and a packaging method for an organic EL device using the hole substrate.
[1] 1A to 1E are cross-sectional views sequentially illustrating a manufacturing process of a general organic EL device.
[2] 2 is an organic EL package structure according to the prior art.
[3] Figure 3 is a flow chart of the manufacturing process of the organic EL package according to the prior art.
[4] 4 is a manufacturing process diagram of a hole substrate according to the present invention.
[5] 5 is an exemplary organic EL package process according to the present invention.
[6] ※ Explanation of symbols for main parts of drawing
[7] 100: organic EL 200: hole substrate
[8] 210: glass substrate 220: metal thin film
[9] 221: titanium thin film 222: copper thin film
[10] 230: photoresist pattern 240: metal structure
[11] 250: groove 270: hall
[12] 300: sealing cap 340: sealing cap body
[13] 342: moisture-proof material settling groove 346: gap (gap) part
[14] 400: light emitting substrate
[47] As a packaging method of the organic electroluminescent device using the hole substrate according to the present invention for achieving the above object,
[48] A plurality of holes are vertically penetrated, and a hole substrate having a plurality of grooves into which a plurality of sealing caps of the organic light emitting elements are inserted, and a vacuum inhaler, are used to seal the sealing caps of the organic light emitting elements on the light emitting substrate. A package method for packaging an organic electroluminescent device, comprising: a sealing cap adsorption step in which a plurality of sealing caps are inserted into a plurality of the grooves and a sealing cap is vacuum-tightly adhered to the grooves by driving the vacuum suction unit; A sealing cap bonding step of performing sealing sealing by placing the sealing cap on the light emitting substrate; After the completion of the sealing cap bonding step, the driving of the vacuum inhaler is stopped and at the same time, the light emitting substrate cutting step of individually cutting the light emitting substrate for each of the sealing cap 300; including, a large amount of organic electroluminescent device It can be mass-produced.
[49] In addition, in the manufacturing method of the hole substrate comprising a plurality of holes (Hall), the glass substrate is formed with grooves so that a plurality of sealing caps can be placed, to sequentially deposit a titanium thin film and a copper thin film on the glass substrate Forming a metal thin film; Forming a photoresist pattern having the same shape and size as the sealing cap on the copper thin film; A metal structure growth step of growing a metal structure on the copper thin film in which the photoresist pattern is not formed; A peeling step of removing the photoresist pattern using a solvent; A metal thin film removing step of removing the metal thin film exposed by the peeling step by using a solvent; And a hole forming step of vertically penetrating a plurality of holes (Hall) on the glass substrate exposed by the metal thin film removing step at a predetermined interval.
[50] It is preferable that the said solvent is iron chloride aqueous solution and hydrofluoric acid aqueous solution.
[51] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, these examples are merely for illustrative purposes, and the technical idea of the present invention is not limited to these examples.
[52] In the present invention, by using a glass substrate 210 having a hole (Hall) is formed by vacuum adsorption of a plurality of stepped sealing caps 300 at the same time by a vacuum suction method on the light emitting substrate 400 on which a display panel is formed. To provide a way to transfer by attaching.
[53] 4 is a manufacturing process chart of the hole substrate according to the present invention. Referring to FIG. 4, the metal thin film forming step (a) of sequentially depositing the titanium thin film 221 and the copper thin film 222 on the glass substrate 210 and the photoresist pattern 230 on the copper thin film 222. Photoresist pattern forming step (b) of forming a partially) and a metal structure for growing a metal structure 240 on the copper thin film 222, the photoresist pattern 230 is not formed by the electroplating method A growth step (c), a peeling step (d) of dissolving the photoresist pattern 230 using a solvent, and the copper thin film 222 and the titanium thin film 221 exposed by the peeling step (d). A metal thin film removal step (e) of sequentially removing the copper thin film 222 and the titanium thin film 221 by using a ferric chloride solution and an aqueous hydrofluoric acid solution (e), and the metal thin film removing step (e). At regular intervals on the glass substrate 210 exposed by (Hall), to write to the rough-hole forming step (f) for a plurality of vertically passing through the 270, thereby completing the manufacturing process of the substrate hole (200).
[54] More specifically, the metal thin film 220, copper (Cu) is used a lot, but the adhesion between the glass substrate 210, which is a glass material is inferior, using the titanium (Ti) good adhesion with the glass material is The titanium thin film 221 is first formed on the glass substrate 210, and then the copper thin film 222 is formed on the formed titanium thin film 221. The thickness of each of the thin films 221 and 222 may vary, but the thickness of the titanium thin film 221 is 0.1 μm and the thickness of the copper thin film 222 is preferably about 0.2 μm.
[55] Then, on the copper thin film 222 so that the shape and size of the sealing cap 300 may be the same to form the groove 250 so that the sealing cap 300 to be described later by the photolithography process can be precisely inserted. The photoresist pattern 230 is formed on the substrate. When the photoresist pattern 230 is formed, the metal structure 240 is grown by the electroplating method on the copper thin film 222 on which the photoresist pattern 230 is not formed. The thickness of the metal structure 240 is preferably about 30um ~ 200um.
[56] When the metal structure 240 is formed as described above, the photoresist pattern 230 is separated by a solvent. When the photoresist pattern 230 is removed, the metal thin film layer 220 is exposed at the removed portion, and the copper thin film 222 and the titanium thin film 221 are sequentially removed using an aqueous iron chloride solution and an aqueous hydrofluoric acid solution. . When the metal thin film layer 220 is removed, since the metal structure 240 and the metal thin film 220 supporting the fine structure are finely protruded on the glass substrate 210 from which they are removed, a plurality of metal structures 240 may be disposed between the metal structures 240. The recess 250 is formed. A plurality of holes 270 vertically penetrating the glass substrate 210 at regular intervals using a method such as a drill or a sandblast to the glass substrate 210 corresponding to the groove 250. ), The hole substrate 200 is completed.
[57] The hole substrate 200 manufactured as described above is subjected to vacuum suction of a plurality of sealing caps 300, which will be described later, to be deposited on the light emitting substrate 400 to perform adhesion, thereby to process a plurality of organic ELs in one process. It can be mass-produced by, which is shown in detail in FIG.
[58] The sealing cap 300 used for sealing the organic EL display shown in FIG. 4 includes a sealing cap body 340 having a gap part 346 and a moisture proof material settling groove 342 formed by a plurality of step processing. , It is composed of a moisture-proof material 350 is inserted into the moisture-proof material settling groove 346.
[59] When the sealing cap body 340 is made of a glass material, the step is processed by sandblasting and / or etching to form the gap portion 346 and the moisture-proof material set groove 342, the sealing When the cap body 340 is made of a stainless material, the gap portion 346 and the moisture-proof material set groove 342 is stepped by a mold pressing process.
[60] The sealing cap 300 is completed by inserting the moistureproof material into the moistureproof material settling groove 342 into the sealing cap body 340 having the above configuration.
[61] Hereinafter, a manufacturing method for manufacturing a large amount of organic EL package will be described in detail.
[62] The hole substrate 200 formed by the configuration and manufacturing method as described above is transferred to the place where the plurality of sealing cap 300 is aligned, or the hole by the conveyor system in a state in which the plurality of sealing cap 300 is aligned The first transfer step (A) is transferred to the lower side of the substrate 200, the hole substrate 200 is downwardly moved so that the sealing cap 300 is inserted one-to-one into the plurality of grooves 250, and the above step When (A) is completed, the vacuum suction device (not shown) is driven to form the upper surface of the sealing cap 300 and the groove 250 through the plurality of holes 270 of the hole substrate 200. By sucking the air present in between, the sealing cap 300 is fixed to the groove 250 and at the same time, the hole substrate 200 is subjected to the sealing cap adsorption step (B) to perform the upward movement.
[63] When the above step (B) is completed, the second transfer step is variable to the position where the light emitting substrate 400 is located, or the light emitting substrate 400 is located below the hole substrate 200 by a conveyor system (C) and the hole substrate 200 is downwardly moved so that the sealing cap 300 is placed on the light emitting substrate 400, and the light emitting substrate 400 and the sealing cap 300 are irradiated with ultraviolet rays. The lower end surface 344 of the adhesive is firmly fastened, so that the gap portion 346 is subjected to the sealing cap bonding step (D) to be blocked from the outside air.
[64] When the step (D) is completed, the driving of the vacuum inhaler (not shown) is stopped, and the light emitting substrate cutting step (E) of individually cutting the light emitting substrate 400 by the plurality of sealing caps 300 is completed. As a result, the manufacture of the plurality of organic ELs 100 is completed.
[65] As described above, since the hole substrate of the present invention is manufactured based on the photolithography process, it has a high positional accuracy, and when the organic EL is packaged by applying it, a small sealing cap can be used to reduce the thickness of the organic EL. There is an effect that the sealing package of the sealing cap with high position accuracy on the light emitting substrate of the area is possible.
[66] In addition, a large number of organic EL devices can be mass-produced by encapsulating a plurality of organic electroluminescent devices or electronic devices formed on a large area light emitting substrate at a time by using a hole substrate and cutting them into individual organic electroluminescent devices. As a result, the productivity of the product can be improved and the manufacturing cost can be reduced.

权利要求:
Claims (3)
[1" claim-type="Currently amended] A plurality of holes are vertically penetrated, and a hole substrate having a plurality of grooves into which a plurality of sealing caps of the organic light emitting elements are inserted, and a vacuum inhaler, are used to seal the sealing caps of the organic light emitting elements on the light emitting substrate. In the packaging method of the organic EL device to be packaged,
A sealing cap adsorption step in which a plurality of sealing caps are inserted into the plurality of grooves and a sealing cap is vacuum-tightly adhered to the grooves by driving the vacuum suction unit;
A sealing cap bonding step of performing sealing by placing the sealing cap on the light emitting substrate;
After the completion of the sealing cap bonding step, the driving of the vacuum inhaler is stopped and at the same time, the light emitting substrate cutting step of individually cutting the light emitting substrate for each of the sealing cap 300; including, a large amount of organic electroluminescent device Package method of an organic EL device, characterized in that the mass production.
[2" claim-type="Currently amended] In the manufacturing method of the hole substrate comprising a plurality of holes (Hall), the glass substrate is formed with grooves so that a plurality of sealing caps can be placed,
A metal thin film forming step of sequentially depositing a titanium thin film and a copper thin film on the glass substrate;
Forming a photoresist pattern having the same shape and size as the sealing cap on the copper thin film;
A metal structure growth step of growing a metal structure on the copper thin film in which the photoresist pattern is not formed;
A peeling step of removing the photoresist pattern using a solvent;
A metal thin film removing step of removing the metal thin film exposed by the peeling step by using a solvent;
And a hole forming step of vertically penetrating a plurality of holes (Hall) at a predetermined interval through the glass substrate exposed by the metal thin film removing step.
[3" claim-type="Currently amended] The method of claim 2, wherein the solvent,
Method for producing a vacuum suction hole substrate, characterized in that the aqueous iron chloride solution and hydrofluoric acid solution.

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同族专利:

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公开号 | 公开日

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KR100545330B1|2006-01-24|

引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2002-12-31|Application filed by 주식회사 멤스웨어

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2002-12-31|Priority to KR1020020087984A

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2004-07-07|Publication of KR20040061697A

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2006-01-24|Application granted

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2006-01-24|Publication of KR100545330B1

优先权:

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申请号 | 申请日 | 专利标题

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KR1020020087984A|KR100545330B1|2002-12-31|2002-12-31|Manufacturing method of hall board for vacuum suction and packaging method of the organic electroluminescent using the hall board|